Method of making a compliant printed circuit peripheral lead semiconductor package

摘要

A compliant printed circuit semiconductor package including a compliant printed circuit with at least a first dielectric layer selectively printed on a substrate with first recesses. A conductive material is printed in the first recesses to form contact members accessible along a first surface of the compliant printed circuit. At least one semiconductor device is located proximate the first surface of the compliant printed circuit. Wirebonds electrically couple terminals on the semiconductor device to the contact members. Overmolding material seals the semiconductor device and the wirebonds to the first surface of the compliant printed circuit. Contact pads on a second surface of the compliant printed circuit are electrically coupled to the contact members.

主权项

1. A method of making a compliant printed circuit semiconductor package comprising the steps of:
selectively printing at least a first dielectric layer on a substrate to create a plurality of first recesses; metalizing the first recesses to form contact members accessible along a first surface of a compliant printed circuit and contact pads accessible along a second surface, where the contact members are electrically coupled to the contact pads; locating a plurality of semiconductor devices proximate the first surface of the compliant printed circuit; forming a plurality of dielectric layers on the first dielectric layer; forming a circuit geometry in at least one of the plurality of dielectric layers to include at least one intra-die circuit path wirebonding terminals on the semiconductor devices to the contact members; and overmolding the semiconductor devices and the wirebonds to the first surface of the compliant printed circuit.