发明名称 |
Embedded test structure for trimming process control |
摘要 |
In some embodiments, a method of controlling a photoresist trimming process in a semiconductor manufacturing process may include forming a photoresist layer atop a first surface of a substrate, wherein the photoresist layer comprises a lower layer having a first pattern to be etched into the first surface of the substrate, and an upper layer having a second pattern that is not etched into the first surface of the substrate; trimming the photoresist layer in a direction parallel to the first surface of the substrate; measuring a trim rate of the second pattern using an optical measuring tool during the trimming process; and correlating the trim rate of the second pattern to a trim rate of the first pattern to control the trim rate of the first pattern during the trimming process. |
申请公布号 |
US8956886(B2) |
申请公布日期 |
2015.02.17 |
申请号 |
US201414204668 |
申请日期 |
2014.03.11 |
申请人 |
Applied Materials, Inc. |
发明人 |
Banna Samer;Joubert Olivier;Lian Lei;Darnon Maxime;Posseme Nicolas;Vallier Laurent |
分类号 |
H01L21/00;H01L21/66;H01L21/311;H01L21/027;H01L21/67;H01L21/308;H01L21/3213;G03F7/20 |
主分类号 |
H01L21/00 |
代理机构 |
Moser Taboada |
代理人 |
Moser Taboada ;Taboada Alan |
主权项 |
1. A method for controlling a photoresist trimming process in a semiconductor manufacturing process, comprising:
forming a photoresist layer atop a first surface of a substrate, wherein the photoresist layer comprises
a lower layer formed atop the first surface of the substrate and having a first pattern to be etched into the first surface of the substrate, andan upper layer having a second pattern that is not etched into the first surface of the substrate; trimming the photoresist layer in a direction parallel to the first surface of the substrate; measuring a trim rate of the second pattern using an optical measuring tool during the trimming process; and correlating the trim rate of the second pattern to a trim rate of the first pattern to control the trim rate of the first pattern during the trimming process. |
地址 |
Santa Clara CA US |