| 摘要 |
Disclosed are a semiconductor package and a method for manufacturing the same. A semiconductor package according to an embodiment of the present invention includes a first semiconductor package which includes a first semiconductor chip and a first mold layer molding the first semiconductor chip; a second semiconductor package which includes a second semiconductor chip electrically connected to the first semiconductor chip and a second mold chip molding the second semiconductor chip; and a mold bonding layer in which at least one of the first semiconductor chip and the second semiconductor chip is molded and the first semiconductor package and the second semiconductor package are combined. |
