| 摘要 |
<p>The present invention relates to a method for sintering copper ink using laser and, more particularly, to a method for sintering copper ink using laser to sinter the copper ink, which is applied to a substrate to form a print pattern, by irradiating the copper ink with a laser beam. The method for sintering copper ink using laser according to the present invention comprises: an ink application step of forming a print pattern by applying copper ink containing copper to a substrate; and a sintering step of sintering the copper ink by irradiating the copper ink with a laser beam using a laser device, wherein the intensity of the laser beam is greater than or equal to 100 W/cm^2 and lower than a melting point of the copper contained in the copper ink, and the laser device moves a distance as much as the size of the laser beam irradiated to the substrate per unit time at a scanning speed of 0.6 to 5 mm/s.</p> |
