发明名称 Oversized interposer
摘要 An embodiment of an interposer is disclosed. For this embodiment of the interposer, a first circuit portion is created responsive to a first printing region. A second circuit portion is created responsive to a second printing region. The interposer has at least one of: (a) a length dimension greater than a maximum reticle length dimension, and (b) a width dimension greater than a maximum reticle width dimension.
申请公布号 US8957512(B2) 申请公布日期 2015.02.17
申请号 US201213527453 申请日期 2012.06.19
申请人 Xilinx, Inc. 发明人 Hisamura Toshiyuki
分类号 H01L23/02;H01L21/00 主分类号 H01L23/02
代理机构 代理人 Webostad W. Eric
主权项 1. An interposer, comprising: a first circuit portion created responsive to a first printing region; and a second circuit portion created responsive to a second printing region; wherein the interposer has at least one of: (a) a length dimension greater than a maximum reticle length dimension, and (b) a width dimension greater than a maximum reticle width dimension; and wherein first conductive lines of the first circuit portion interconnect with second conductive lines of the second circuit portion with bulging at intersections thereof responsive to the first printing region and the second printing region printed overlapping or abutting one another.
地址 San Jose CA US