| 摘要 |
<p>A semiconductor package, a semiconductor package unit, and a method for manufacturing a semiconductor package are disclosed. The semiconductor package, according to an embodiment of the present invention, comprises: a first semiconductor chip package including a first semiconductor chip, a first mold layer for molding the first semiconductor chip, and an external terminal electrically connected to the first semiconductor chip from the outer region of the first semiconductor chip; and a second semiconductor chip package including a second semiconductor chip electrically connected to the first semiconductor chip, and a second mold layer for molding the external terminal and the second semiconductor chip to expose a portion of the external terminal.</p> |
