| 摘要 |
本发明提供一种切晶带一体型晶圆背面保护膜，其包括：一切晶带，其包括一基底材料及一形成于该基底材料上之压敏黏接层；及一晶圆背面保护膜，其形成于该切晶带之该压敏黏接层上，其中该晶圆背面保护膜经着色，且该有色晶圆背面保护膜具有3GPa或更大之弹性模数(23℃)。该有色晶圆背面保护膜较佳具有雷射标记能力。该切晶带一体型晶圆背面保护膜可适用于一覆晶安装半导体器件。; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored, and the colored wafer back surface protective film has an elastic modulus (23℃) of 3 GPa or more. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. |
