ELECTRONIC COMPONENT PACKAGING MODULE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electronic component packaging module in which a notch is formed on a side face of an encapsulation body, a side part width surface of a compartment shield structure is exposed in the notch and an electromagnetic shield layer is connected with the side part width surface via the notch.SOLUTION: A manufacturing method of an electronic component packaging module includes the steps of: providing a substrate 110 including a grounding pad 112 on a top surface S1; mounting a plurality of electronic elements 120 on the substrate; forming an encapsulation body 130 so as to cover the plurality of electronic elements; forming a groove part F1 within the encapsulation body and exposing the grounding pad in the groove part in such a manner that an end portion of the groove part is positioned within the encapsulation body but is not brought into contact with a side face of the encapsulation body; forming a compartment shield structure 140 by filling the groove part with a conductive material; forming a notch by removing a part of the encapsulation body in the end portion of the groove part on the side face of the encapsulation body; and forming an electromagnetic shield layer 150 connected with the side part width surface of the compartment shield structure via the notch so as to cover a surface of the encapsulation body and the compartment shield structure.