| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component device, improved in reliability of electrical connection, using an underfill material which is applied to a pre-application system and capable of shortening a curing time and reducing generation of voids.SOLUTION: The manufacturing method of the electronic component device for manufacturing the electronic component by electrically connecting an electronic component and a wiring board via a connection part includes: an application step of applying the underfill material to at least either a surface of the electronic component opposing the wiring board or a surface of the wiring board opposing the electronic component; and a connection step of connecting the electronic component and the wiring board via the connection part and curing the underfill material. The underfill material contains an epoxy resin, an epoxy resin curative agent, a compound with ethylenic unsaturated double bonds and an inorganic filler. The underfill material contains, as the compound with the ethylenic unsaturated double bonds, a compound with ethylenic unsaturated double bonds and an epoxy group within one molecule. |
