MEMBER FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a member for manufacturing a semiconductor device, which is applicable to a three-dimensional semiconductor fabrication that requires fine processing and high density, and to provide a method for manufacturing a semiconductor device with sufficiently high efficiency at a low cost by using the above member.SOLUTION: The method for manufacturing a semiconductor device includes steps of: forming a temporary fixing layer 2 on a support body 1; forming a metal layer on the temporary fixing layer 2; forming a photosensitive resin layer on the metal layer and then subjecting the photosensitive layer to exposure and development to form a pattern of the photosensitive resin to expose a part of the metal layer; removing a part of the metal layer by etching to expose a part of the temporary fixing layer 2; fixing a semiconductor element on the temporary fixing layer 2 so as to bond an active surface of the semiconductor to the temporary fixing layer 2; encapsulating these layers with an encapsulation resin so as to cover at least a part of the semiconductor element; removing at least a part of the encapsulation resin to expose a part 3a of the metal layer; removing the support body 1; removing the temporary fixing layer 2; and forming a rewiring layer on a face where the temporary fixing layer 2 is removed.