| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor element capable of downsizing by reducing the wiring space of a piezoelectric element.SOLUTION: A sensor element comprises: a base part 21 having a support arm 212; first and second driving vibration arms 25, 26, 27, 28 extending from the support arm 212 in directions opposite to each other; and first and second drive units 51, 52, provided ranging from the first driving vibration arm 25 to the second driving vibration arm 26, for causing bending vibration to the vibration arm. Each of the first and second drive units 51, 52 has an upper electrode layer, a lower electrode layer, and a piezoelectric layer, the lower electrode layer being disposed on the vibration arm side relative to the upper electrode layer. The second drive unit 52 is provided on the base part 21 side relative to the first drive unit 51. A first upper wiring 313 electrically connecting to the first upper electrode layer and a first lower wiring 311 electrically connecting to the first lower electrode layer are extended to a side of the second upper electrode layer opposite the second piezoelectric layer and are layered in the support arm 212 via an insulation layer. |
