| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent via paste from being detached from a via hole when releasing a protective film after filling with the via paste in manufacture of a wiring board comprising a via conductor.SOLUTION: A manufacturing method of a wiring board with a via comprising an insulative substrate, a conductor wiring layer and a via conductor penetrating the insulative substrate includes: a via hole forming step of forming a via hole which penetrates a releasable protective film deposited on a surface of the insulative substrate opposite to the conductor wiring layer and the insulative substrate and defines the conductor wiring layer as a bottom part, on a wiring board with the protective film comprising the insulative substrate, the conductor wiring layer and the protective film; a via primer layer forming step of forming a via primer layer containing a via primer component with bondability with the via paste on a surface of the conductor wiring layer exposed in the via hole; a filling step of filling the inside of the via hole with the via paste containing a conductive material and an organic material from the side of the protective film; and a releasing step of releasing the protective film from the insulative substrate. The manufacturing method includes these steps in this order.</p> |
