发明名称 POLYIMIDE POWDER COMPOSITION EXCELLENT IN FLUIDITY, AND MOLDING THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a polyimide powder composition for imparting excellent fluidity, high packability or the like to polyimide powder, and to provide a molding obtained by using the polyimide powder composition.SOLUTION: The polyimide powder composition, in which a silica fine particle is stuck to the surface of the polyimide powder, is prepared by a method comprising: a step (A1) of obtaining the hydrophilic spherical silica fine particle comprising a SiOunit substantially; a step (A2) of introducing a RSiOunit into the surface of the hydrophilic spherical silica fine particle; and a step (A3) of introducing a RSiOunit to obtain a hydrophobic spherical silica fine particle (1) being the polyimide powder composition. The hydrophobic spherical silica fine particle has 0.005-1.0 μm particle size, 3 or smaller value of a particle size distribution D90/D10 and 0.8-1.0 average degree of circularity. The molding is obtained by using the polyimide powder composition.
申请公布号 JP2015030826(A) 申请公布日期 2015.02.16
申请号 JP20130163116 申请日期 2013.08.06
申请人 SHIN ETSU CHEM CO LTD 发明人 MATSUMURA KAZUYUKI;SAKAZUME KATSUAKI
分类号 C08J3/12;C01B33/18;C08K9/06;C08L79/08 主分类号 C08J3/12
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