ELECTROLYTIC COPPER FOR PLATING AND PRODUCTION METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide electrolytic copper having little amount of impurities, which is copper in a pellet form to be used as a supply source of copper in copper plating, and to provide a production method of the electrolytic copper.SOLUTION: The electrolytic copper has a sulfur (S) impurity concentration of 5 ppm or less and has a cylindrical form having a ratio (D/R) of a height difference (D) to a diameter (R) of the electrolytic copper of 0.08 or less. The production method of electrolytic copper comprises forming a circular opening in a resist and electrodepositing electrolytic copper on the opening. The electrolytic copper is produced by directly applying a DC current between a cathode and an anode separated from each other and disposed in an electrolytic solution so as to electrodeposit copper on a circular opening of a resist that is disposed on a surface of the cathode opposing to the anode. The production method of electrolytic copper is carried out in such a manner that, in a period until a height of the electrolytic copper electrodeposited on the opening reaches a thickness HR (mm) of the resist, a current density A of the DC current satisfies A<-18×H+10, and after the period, A satisfies A<15.