| 摘要 |
PROBLEM TO BE SOLVED: To provide an open hole formation method in a glass substrate hardly generating necking in the open hole, and hardly generating a crack on an open hole formation position.SOLUTION: In a discharge auxiliary type laser hole processing method, an open hole is formed in a glass substrate by laser light irradiation, and the shape of the open hole is adjusted by a discharge phenomenon through the open hole. In the discharge auxiliary type laser hole processing method, COlaser having a wavelength of 9.3 μm or 9.6 μm is used as laser light. |
