| 摘要 |
PROBLEM TO BE SOLVED: To reduce a thermal shock given to a heater, the thermal shock being generated at the upstream side in a flow channel, of a heater device.SOLUTION: A heater 10 includes: a ceramic body 1; a heating resistor 2 installed in the ceramic body 1; a metal cylinder 3 into which the whole ceramic body 1 is inserted; and filler 7 filled between an outer peripheral surface of the ceramic body 1 and an inner peripheral surface of the metal cylinder 3. An outer peripheral surface of the metal cylinder 3 has a heating region 30 brought into contact with an object to be heated flowing from one end side 14 to the another end side 15 of the ceramic body 1. In the filler 7, a void ratio on the one end side 14 of the ceramic body 1 is larger than a void ratio on the another end side 15. Since sudden cooling on the one end side 14 of the ceramic body 1 can be suppressed, a thermal shock generated at the upstream X side in a flow channel of the heater 10 can be reduced. |
