发明名称 |
RESIN SEALING MOLD, RESIN SEALING METHOD, AND METHOD FOR CLEANING RESIN SEALING MOLD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing mold which can ensure workpiece adsorption.SOLUTION: An upper mold 11 includes cavity recesses 14 in which a sealing resin R is filled at the time of resin sealing. A lower mold 12 includes an insert 15 which is provided with a plurality of adsorption grooves 16 opening in a mold clamp surface on which a workpiece W is arranged, and a plurality of blocks 17 in the groove which are respectively provided in the plurality of adsorption grooves 16. A suction passage 21 sucking the workpiece W is formed in a clearance 22 between an inner wall surface of the adsorption groove 16 and an outer wall surface of the block 17 in the groove. A tip of the block 17 in the groove facing the mold clamping surface from the adsorption groove 16 is chamfered in a tapered shape. |
申请公布号 |
JP2015030235(A) |
申请公布日期 |
2015.02.16 |
申请号 |
JP20130163076 |
申请日期 |
2013.08.06 |
申请人 |
APIC YAMADA CORP |
发明人 |
MORIMURA MASAHIRO;NARITA KAZUO;OTSUBO YASUSHI |
分类号 |
B29C33/18;H01L21/56 |
主分类号 |
B29C33/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|