发明名称 RESIN SEALING MOLD, RESIN SEALING METHOD, AND METHOD FOR CLEANING RESIN SEALING MOLD
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing mold which can ensure workpiece adsorption.SOLUTION: An upper mold 11 includes cavity recesses 14 in which a sealing resin R is filled at the time of resin sealing. A lower mold 12 includes an insert 15 which is provided with a plurality of adsorption grooves 16 opening in a mold clamp surface on which a workpiece W is arranged, and a plurality of blocks 17 in the groove which are respectively provided in the plurality of adsorption grooves 16. A suction passage 21 sucking the workpiece W is formed in a clearance 22 between an inner wall surface of the adsorption groove 16 and an outer wall surface of the block 17 in the groove. A tip of the block 17 in the groove facing the mold clamping surface from the adsorption groove 16 is chamfered in a tapered shape.
申请公布号 JP2015030235(A) 申请公布日期 2015.02.16
申请号 JP20130163076 申请日期 2013.08.06
申请人 APIC YAMADA CORP 发明人 MORIMURA MASAHIRO;NARITA KAZUO;OTSUBO YASUSHI
分类号 B29C33/18;H01L21/56 主分类号 B29C33/18
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