| 摘要 |
<p>PROBLEM TO BE SOLVED: To promote space saving while reducing the effect of foreign substances, flaws, or the like on a translucent member covering an imaging region on imaging performance.SOLUTION: A solid imaging device 1 includes a semiconductor chip 2 having an imaging region 2a, a wiring board 3 which has an opening part 3a at least in a region corresponding to the imaging region 2a, and is jointed to a surface on the imaging region 2a side of the semiconductor chip 2, a translucent member 4 which is disposed to cover the opening part 3a and is fixed to a surface on the side opposite to the semiconductor chip 2 of the wiring board 3, and an electronic component 5 which is disposed between the wiring board 3 and the translucent member 4, and is connected electrically to the wiring board 3.</p> |
