发明名称 METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANAGING MANUFACTURING STEP OF SILICON CARBIDE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a silicon carbide semiconductor device capable of achieving stable quality and improved yield of the silicon carbide semiconductor device by highly accurately managing temperatures, and a method for managing a manufacturing step of the silicon carbide semiconductor device.SOLUTION: A method for manufacturing a silicon carbide semiconductor device comprises the steps of: (a) preparing a silicon carbide base; (b)forming a carbon protective film 20 on the base; (c) performing thermal treatment for the base and the carbon protective film; and (d) measuring a temperature on the base by analyzing the carbon protective film by Raman spectroscopy after the step (c).
申请公布号 JP2015032678(A) 申请公布日期 2015.02.16
申请号 JP20130160909 申请日期 2013.08.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 OKABE HIROAKI;FURUHASHI AKIYUKI
分类号 H01L21/265;H01L21/205;H01L21/336;H01L29/12;H01L29/78 主分类号 H01L21/265
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