| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin sealing method of an electronic component which is capable of performing resin sealing of the electronic component surely and in a short time, and for which it is not necessary to grasp and hang a terminal lead in the air even in the case where the terminal lead is included, and a resin sealed electronic component formed by sealing the electronic component with the resin sealing method.SOLUTION: The resin sealing method of the electronic component includes the steps of: molding a bottom face side holding member 30a for holding a bottom face side of an electronic component 12 and a top face side holding member 50a for holding a top face side so as not to be perfectly cured by pressurizing and heating powder-state thermally curable resin composition; holding the electronic component between the bottom face side holding member and the top face side holding member and disposing this electronic component in an internal space of metal dies 60 and 62; and causing a molten thermally curable resin composition 70 of the same material as the bottom face side holding member and the top face side holding member to flow into the internal space of the metal dies, integrating and perfectly curing the molten thermally curable resin composition, the bottom face side holding member and the top face side holding member, thereby forming an integrated thermally curable resin coating layer 14.</p> |
