| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the size of a solid-state imaging device.SOLUTION: A solid-state imaging device includes: a semiconductor substrate 30 having a first surface FS and a second surface BS facing the first surface FS; a first insulating film 90 provided on the first surface FS side of the semiconductor substrate 30 and including multilayer wiring; a pixel 1 provided in the semiconductor substrate 30 and for photoelectrically converting light radiated from the second surface BS side; a first circuit 7 provided on the first surface FS side of the semiconductor substrate 30 and covered with the first insulating film 90; and one or more first elements CE and RE provided on the second surface BS side of the semiconductor substrate 30.</p> |
