| 摘要 |
<p>The present invention relates to a resin molding apparatus of an electronic component. More particularly, the present invention relates to a resin molding apparatus of an electronic component, capable of preventing the hardening of an injected liquid-phase resin in an injection process by supplying a liquid-phase resin with high viscosity into a molding frame of high temperature after the liquid-phase resin is sprayed onto the outside with constant quantity, and a method thereof. A resin molding apparatus of an electronic component according to the present invention includes a molding frame which comprises an upper mold and a lower mold and pressurizes and molds a liquid-phase resin at high temperature; a film supplying part which supplies a release film to the lower mold; and a resin injection part which injects the liquid-phase resin to the release film. The resin injection part injects the liquid-phase resin onto the release film on the outside of the molding frame.</p> |
