发明名称 ULTRAVIOLET IRRADIATION APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>The objective of the present invention is to emit a uniform ultraviolet ray to a substrate surface. An ultraviolet irradiation apparatus (40) includes a wafer holding unit (101), an ultraviolet irradiation chamber (103) which has a light source (102) which emits an ultraviolet ray and a transfer unit (110, 111) through which the wafer holding unit passes (101), an exhaust unit (120) which discharges gas in the ultraviolet irradiation chamber (103) and decompress it, a before-irradiation waiting part (106) which lets the wafer holding unit (101) wait, an after-irradiation retreating part (107) which is installed to the opposite side of the before-irradiation waiting part (106) across the ultraviolet irradiation chamber (103), and a holding unit transferring unit (105) which moves the wafer holding unit (101). The light source (102) is a gauge-rod-shaped lamp which extends in a direction vertical to a direction in which the wafer holding unit (101) moves. The width of the ultraviolet irradiation chamber (103) in the direction vertical to the extended direction of the lamp is narrower than the diameter of a wafer (W).</p>
申请公布号 KR20150016887(A) 申请公布日期 2015.02.13
申请号 KR20140078855 申请日期 2014.06.26
申请人 发明人
分类号 G03F7/20;H01L21/027 主分类号 G03F7/20
代理机构 代理人
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