发明名称 COPPER STRIP, PLATED COPPER STRIP AND LEAD FRAME
摘要 <p>Provided are a copper strip, a plated copper strip, and a lead frame which can form a surface coating layer with high reflectivity. The copper strip is mounted with a bottom coating layer growth surface on which a bottom coating layer grows. At least any one among regions consisting of an amorphous region or minute grain is formed on the bottom coating layer growth surface in order to uniformize the rate of the bottom coating layer on the bottom coating layer growth surface of the copper strip.</p>
申请公布号 KR20150016885(A) 申请公布日期 2015.02.13
申请号 KR20140069818 申请日期 2014.06.10
申请人 发明人
分类号 C23C2/04;C23C2/40;C23F1/02 主分类号 C23C2/04
代理机构 代理人
主权项
地址
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