摘要 |
Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent. |
主权项 |
1. A black photosensitive resin composition comprising at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant which is substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant which reflects light having a wavelength falling within an infrared range, and (F) an organic solvent;
the flame retardant (C) being at least one kind selected from the group consisting of (c1) a phosphorus compound and (c3) a metal hydroxide. |