发明名称 BLACK PHOTOSENSITIVE RESIN COMPOSITION AND USE OF SAME
摘要 Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent.
申请公布号 US2015044451(A1) 申请公布日期 2015.02.12
申请号 US201214363058 申请日期 2012.11.20
申请人 Kaneka Corporation 发明人 Kido Masayoshi;Sekito Yoshihide
分类号 C08L33/10;H05K1/03;C08L75/14 主分类号 C08L33/10
代理机构 代理人
主权项 1. A black photosensitive resin composition comprising at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant which is substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant which reflects light having a wavelength falling within an infrared range, and (F) an organic solvent; the flame retardant (C) being at least one kind selected from the group consisting of (c1) a phosphorus compound and (c3) a metal hydroxide.
地址 Osaka-shi JP