PHYSICAL VAPOR DEPOSITION APPARATUS AND PHYSICAL VAPOR DEPOSITION METHOD

摘要

A physical vapor deposition apparatus and a physical vapor deposition method for forming a film of a substance which is hard to be made fine particles even when it is heated by plasma, arc discharge, or the like are provided. It has an evaporation chamber 10 provided inside it with an evaporation source material 15 and a heating part 16 for heating the evaporation source material 15, a powder supply source 20 provided inside it with a powder, and a film forming chamber 30, wherein the evaporation source material 15 is heated by the heating part 16 to produce fine particles (nanoparticles), the fine particles and powder are sprayed out of a supersonic nozzle 35, are placed on a supersonic gas stream, and are deposited on a substrate for film formation 33 by physical vapor deposition.

主权项

1. A physical vapor deposition method, including
a production step of heating and evaporating an evaporation source material in a predetermined gas atmosphere or an air atmosphere in an evaporation chamber by a heating part for evaporating the evaporation source material and producing fine particles from evaporated atoms;
a stirring step of stirring a power having a particle size of not more than several tens of micrometers in a vessel of a powder supply by causing the vessel to vibrate; and a film forming step of transporting the fine particles and placing these on a supersonic gas stream created by a supersonic nozzle, transporting the powder from the powder supply source and placing it on a supersonic gas stream created by a supersonic nozzle different from the previously described supersonic nozzle, and depositing the fine particles and the powder on a substrate for film formation by physical vapor deposition to form a film containing the fine particles and the powder in the film forming chamber.