发明名称 |
Electronic module and method of manufacturing the same |
摘要 |
According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures. |
申请公布号 |
US2015043169(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
US201313964263 |
申请日期 |
2013.08.12 |
申请人 |
Infineon Technologies AG |
发明人 |
WINTER Frank;GEITNER Ottmar;NIKITIN Ivan;HOEGERL Juergen |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic module comprising,
an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component; and a mold compound at least partially enclosing the electronic chip and the spacing element; wherein the spacing element comprises a lateral surface which is in contact to the mold compound and comprises at least one surface structure. |
地址 |
Neubiberg DE |