| 发明名称 |
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEATSINK, POWER MODULE, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE |
| 摘要 |
A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding. |
| 申请公布号 |
US2015041188(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201314388051 |
申请日期 |
2013.03.29 |
| 申请人 |
MITSUBISHI MATERIAL CORPORATION |
发明人 |
Terasaki Nobuyuki;Nagatomo Yoshiyuki;Kuromitsu Yoshirou |
| 分类号 |
H05K1/02;H05K1/18;H05K3/10;H05K1/09 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module substrate comprises an insulation layer and a circuit layer formed on a surface of the insulation layer,
wherein the circuit layer comprises an aluminum layer arranged on the surface of the insulation layer and a copper layer laminated on one side of the aluminum layer, wherein the aluminum layer and the copper layer are bonded together by solid phase diffusion bonding. |
| 地址 |
Tokyo JP |
