发明名称 |
THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME |
摘要 |
A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer. |
申请公布号 |
US2015041184(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
US201314385156 |
申请日期 |
2013.03.14 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Nam Myoung Hwa;Kim Byeong Ho;Seo Yeong Uk;Seo Hyun Seok;Yoo Chang Woo;Lee Sang Myung |
分类号 |
H05K1/03;H05K1/11;H05K1/02 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
1. A printed circuit board comprising:
a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereat and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. |
地址 |
Seoul KR |