PROCESS FOR MANUFACTURING A NOZZLE PLATE AND FLUID-EJECTION DEVICE PROVIDED WITH THE NOZZLE PLATE

摘要

A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.

主权项

1. A process for forming a nozzle plate for a fluid-ejection device, the process comprising:
forming a structural layer over a first side of a first substrate of semiconductor material, the structural layer having a respective first side and second side, the second side of the structural layer facing the first side of the first substrate; forming a first through hole in the structural layer by removing a portion of the structural layer, said first through hole having sidewalls that extend between an inlet section at the first side of the structural layer and an outlet section at the second side of the structural layer; forming a narrowing element on the sidewalls of the first through hole; tapering the narrowing element so that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole; and removing the first substrate.