摘要 |
<p>PROBLEM TO BE SOLVED: To provide a phenolic resin molding material which has excellent thermosetting properties in a heated mold, and retains fluidity in a heating cylinder by suppressing a curing reaction.SOLUTION: A phenolic resin molding material contains a novolak type phenol resin having an ortho/para binding ratio of 1.2 or more and 3.0 or less, and oxidized polyethylene having an acid value of 10 mgKOH/g or more and 40 mgKOH/g or less. Preferably, a content of the oxidized polyethylene with respect to 100 pts.mass of the novolak type phenol resin is 0.5 pt.mass or more and 10 pts.mass or less.</p> |