发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide a phenolic resin molding material which has excellent thermosetting properties in a heated mold, and retains fluidity in a heating cylinder by suppressing a curing reaction.SOLUTION: A phenolic resin molding material contains a novolak type phenol resin having an ortho/para binding ratio of 1.2 or more and 3.0 or less, and oxidized polyethylene having an acid value of 10 mgKOH/g or more and 40 mgKOH/g or less. Preferably, a content of the oxidized polyethylene with respect to 100 pts.mass of the novolak type phenol resin is 0.5 pt.mass or more and 10 pts.mass or less.</p>
申请公布号 JP2015028166(A) 申请公布日期 2015.02.12
申请号 JP20140133513 申请日期 2014.06.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 WATANABE HIRONORI;KOIZUMI KOJI
分类号 C08L61/10;C08K3/00;C08K5/3477;C08L23/30 主分类号 C08L61/10
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