发明名称 温度センサ、温度センサの製造方法、半導体装置及び半導体装置の製造方法
摘要 <p>A disclosed temperature sensor includes a charge trap structure including a silicon oxide film formed on a substrate; an aluminum oxide film that is formed on the silicon oxide film, wherein oxygen is injected into the aluminum oxide film from an upper surface thereof; and an electrode formed on the aluminum oxide film, wherein a flat band voltage of the charge trap structure is temperature dependent.</p>
申请公布号 JP5666319(B2) 申请公布日期 2015.02.12
申请号 JP20110004342 申请日期 2011.01.12
申请人 发明人
分类号 G01K7/01 主分类号 G01K7/01
代理机构 代理人
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