| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a sealing resin in a semiconductor device from peeling off.SOLUTION: A semiconductor device comprises a metal layer 3 and a metal layer 4 which are adjacent to each other and formed of rectangle metal, in which the metal layer 4 is formed to have a larger size than that of the metal layer 3. When the metal layer 4 is laminated on the metal layer 3 with the center being aligned with the center of the metal layer 3, an end face position 11 around the metal layer 4 is uniformly displaced in a plane direction of the metal layer 4 from an end face position 12 around the metal layer 3 to form a protruding engagement part 13 and a space 14. A resin 15 which seals a ceramic layer 2, the metal layer 3, the metal layer 4, and a semiconductor element 5 that constitute the semiconductor device as well as a part of an electrode 9 and an electrode 10, fills the space 14 of the engagement part 13. Accordingly, since a force of peeling the resin 15 off from the metal layer 3 and the metal layer 4 is received by the resin 15 being caught at the engagement part 13, the resin 15 is prevented from peeling off from the metal layer 3 and the metal layer 4.</p> |
