SYSTEMS AND METHODS TO FABRICATE A RADIO FREQUENCY INTEGRATED CIRCUIT

摘要

To reduce radio frequency (RF) losses during operation of a radio frequency integrated circuit (RFIC) module, the RFIC module is fabricated such that at least one of an edge of the wirebond pad on the copper trace and a sidewall of the copper trace is free from high-resistivity plating material. The unplated portion provides a path for the RF current to flow around the high-resistivity material, which reduces the RF signal loss associated with the high resistivity plating material.

主权项

1. A method to fabricate a radio frequency integrated circuit (RFIC) module, the method comprising:
plating a nickel layer over a portion of a top surface of a copper trace, the copper trace including at least a sidewall and formed on a substrate; plating a palladium layer over the nickel layer; and plating a gold layer over the palladium layer, the nickel, palladium, and gold layers forming a wire bonding pad that covers a plated portion of the copper trace leaving an unplated portion of the copper trace that is substantially parallel to the wire bonding pad along the sidewall, the unplated portion forming an unplated path along the copper trace and configured to conduct radio frequency (RF) current during operation of the RFIC module and reduce RF power loss.