发明名称 RESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME
摘要 A resistive random access memory and a method for fabricating the same are provided. The method includes forming a bottom electrode on a substrate; forming a metal oxide layer on the bottom electrode; forming an oxygen atom gettering layer on the metal oxide layer; forming a first top electrode sub-layer on the oxygen atom gettering layer; forming a second top electrode sub-layer on the first top electrode sub-layer, wherein the first top electrode sub-layer and the second top electrode sub-layer comprise a top electrode; and subjecting the metal oxide layer and the oxygen atom gettering layer to a thermal treatment, driving the oxygen atoms of the metal oxide layer to migrate into and react with the oxygen atom gettering layer, resulting in a plurality of oxygen vacancies within the metal oxide layer.
申请公布号 US2015044851(A1) 申请公布日期 2015.02.12
申请号 US201414521422 申请日期 2014.10.22
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 LEE HENG-YUAN;CHEN PANG-SHIU;WU TAI-YUAN;WANG CHING-CHIUN
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A method for fabricating a resistive random access memory, comprising: forming a bottom electrode on a substrate; forming a metal oxide layer on the bottom electrode; forming an oxygen atom gettering layer on the metal oxide layer to directly contact the metal oxide layer, wherein a material of the metal oxide layer is different from a material of the oxygen atom gettering layer; forming a top electrode on the oxygen atom gettering layer; and subjecting the metal oxide layer and the oxygen atom gettering layer to a thermal treatment, driving the oxygen atoms of the metal oxide layer to migrate into and react with the oxygen atom gettering layer, resulting in a plurality of oxygen vacancies within the metal oxide layer.
地址 Hsinchu TW