Packaging Methods and Structures for Semiconductor Devices

摘要

Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

主权项

1. A method comprising:
forming a redistribution layer (RDL) comprising at least one inter-level dielectric (ILD) and at least one first metallization layer formed in the at least one ILD; coupling a first integrated circuit to a first surface of the RDL, the first integrated circuit in electrical contact with first traces of the at least one first metallization layer; forming a first molding compound over the first integrated circuit and the first surface of the RDL, a first surface of the first molding compound disposed above a top surface of the first integrated circuit; forming a second metallization layer having second traces on the first surface of the first molding compound, the second traces in electrical contact with the first traces; coupling a second integrated circuit to the second traces; and forming a second molding compound over the second integrated circuit and in direct contact with a portion of the first surface of the first molding compound.