发明名称 COPPER FOIL PROVIDED WITH CARRIER FOIL, MANUFACTURING METHOD OF THE COPPER FOIL PROVIDED WITH CARRIER FOIL, AND COPPER CLAD LAMINATE FOR LASER DRILLING MANUFACTURED BY USING THE COPPER FOIL PROVIDED WITH CARRIER FOIL
摘要 An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil comprising a layer structure of the carrier foil/the releasing layer/the bulk copper layer characterized in that metal element-containing particles are disposed between the releasing layer and the bulk copper layer is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.
申请公布号 US2015044492(A1) 申请公布日期 2015.02.12
申请号 US201314381367 申请日期 2013.02.27
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 Yoshikawa Kazuhiro
分类号 H05K1/09;H05K3/38;H05K3/00 主分类号 H05K1/09
代理机构 代理人
主权项 1. A copper foil provided with a carrier foil comprising a layer structure of a carrier foil/a releasing layer/a bulk copper layer, wherein metal element-containing particles are disposed between the releasing layer and the bulk copper layer.
地址 Tokyo JP