发明名称 Electroless Nickel Plating Solution and Method
摘要 An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
申请公布号 US2015044374(A1) 申请公布日期 2015.02.12
申请号 US201313961018 申请日期 2013.08.07
申请人 MacDermid Acumen, Inc. 发明人 Janik Robert;Micyus Nicole J.
分类号 C23C18/16;C23C18/20;C23C18/36;C23C18/18 主分类号 C23C18/16
代理机构 代理人
主权项 1. An electroless nickel plating solution comprising: a) a source of nickel ions; b) a reducing agent; c) one or more complexing agents; d) one or more bath stabilizers; and e) a brightener, said brightener comprising a sulfonated compound selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates.
地址 Waterbury CT US