发明名称 |
Electroless Nickel Plating Solution and Method |
摘要 |
An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value. |
申请公布号 |
US2015044374(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
US201313961018 |
申请日期 |
2013.08.07 |
申请人 |
MacDermid Acumen, Inc. |
发明人 |
Janik Robert;Micyus Nicole J. |
分类号 |
C23C18/16;C23C18/20;C23C18/36;C23C18/18 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
1. An electroless nickel plating solution comprising:
a) a source of nickel ions; b) a reducing agent; c) one or more complexing agents; d) one or more bath stabilizers; and e) a brightener, said brightener comprising a sulfonated compound selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates. |
地址 |
Waterbury CT US |