发明名称 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
摘要 A liquid ejecting head includes a head chip in which two or more nozzle groups are disposed, a first inlet that communicates with one of the nozzle groups and a second inlet that communicates with the other nozzle group a wiring member that is disposed between the first second inlets, a first connection flow path that is connected to the first inlet, a second connection flow path that is connected to the second inlet, and a wiring substrate to which the wiring member is connected between the first connection flow path and the second connection flow path.
申请公布号 US2015042724(A1) 申请公布日期 2015.02.12
申请号 US201414452913 申请日期 2014.08.06
申请人 SEIKO EPSON CORPORATION 发明人 ENOMOTO Katsumi;WATANABE Shunsuke
分类号 B41J2/14 主分类号 B41J2/14
代理机构 代理人
主权项 1. A liquid ejecting head comprising: a head chip in which two or more nozzle groups, each being configured by a plurality of nozzles, are disposed in a reference direction on a liquid ejecting surface, wherein the head chip includes a first inlet that is disposed on a surface side opposite to the liquid ejecting surface to communicate with one of the nozzle groups and a second inlet that communicates with the other nozzle group, wherein the first inlet and the second inlet are disposed in the reference direction; a wiring member with a first end portion connected to a pressure generating unit, which is disposed between the first inlet and the second inlet to generate a pressure change in a flow path in the head chip, and a second end portion extending in the direction opposite to a direction of liquid ejection from the nozzles; a first connection flow path that is connected to the first inlet; a second connection flow path that is connected to the second inlet; and a wiring substrate to which the second end portion of the wiring member is connected between the first connection flow path and the second connection flow path, wherein the second connection flow path includes an extending flow path that extends from the second inlet toward the reference direction separated from the first inlet, and wherein the wiring substrate is arranged on the side of the second connection flow path opposite to the first inlet from the extending flow path to extend in the reference direction beyond the second connection flow path from between the first connection flow path and the second connection flow path.
地址 TOKYO JP
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