发明名称 LIGHT-EMITTING DEVICE AND LIGHTING DEVICE PROVIDED WITH THE SAME
摘要 A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.
申请公布号 US2015041835(A1) 申请公布日期 2015.02.12
申请号 US201414521105 申请日期 2014.10.22
申请人 Sharp Kabushiki Kaisha 发明人 AGATANI Makoto;Hata Toshio;Nada Tomokazu;Ishizaki Shinya
分类号 H01L33/62;H01L33/54;H01L25/075 主分类号 H01L33/62
代理机构 代理人
主权项 1. A light-emitting device comprising: a ceramic substrate having a rectangular outer shape in a top view; a plurality of LED chips positioned around a center of a primary surface of said ceramic substrate; a resin dam formed on the primary surface of said ceramic substrate and provided so as to surround a mounting area in which said plurality of LED chips are provided; a first electrode land and a second electrode land which are electrodes to be connected to a power supply and are electrically connected to said plurality of LED chips, said first and second electrode lands being provided outside said resin dam and near corners of the primary surface of the substrate, each of said first and second electrode lands having a shape defined by first and second sides along the sides of said ceramic substrate defining the corresponding corner, third and fourth sides shorter than and opposing to the first and second sides, respectively, and a fifth side between the third and fourth sides; and a resin layer provided attaching to an inner side of said resin dam and covering said plurality of LED chips.
地址 Osaka JP