| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a slurry for thermal spraying suitable for formation of a useful sprayed coating, in order to prevent plasma erosion of a semiconductor device manufacturing apparatus, flat-panel display manufacturing apparatus or the like. <P>SOLUTION: The slurry for thermal spraying contains an yttrium oxide particle and dispersion media. Purity of the yttrium oxide particle is ≥95 mass%, an average particle diameter of the yttrium oxide particle is ≤6 μm, and content of the yttrium oxide particle in the slurry for thermal spraying is 1.5-30 vol.%. A BET specific surface area of the yttrium oxide particle is preferably 1-25 m<SP>2</SP>/g. Moreover, a relative deposition ratio of the slurry for thermal spraying by a liquid pressure measuring method is preferably ≤30%. <P>COPYRIGHT: (C)2010,JPO&INPIT |
