| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for solder resist which has high light reflectivity, which is hard to be deteriorated by light, and which is suitably utilized for formation of a solder resist layer having high moisture resistance and plating resistance, and to provide a printed wiring board equipped with the solder resist layer formed from this resin composition for the solder resist. <P>SOLUTION: The resin composition for the solder resist contains a resin component containing at least a base resin having a carboxyl group, and a white pigment. The resin component has an aromatic ring, which is contained in a π electron conjugate system in which the number of double bonds is 6 or less, does not have a structure in which two π electron conjugate systems containing the aromatic ring are coupled to each other by a single bond via one carbon atom, and includes a specific resin not having a nitrogen atom and a sulfur atom. <P>COPYRIGHT: (C)2012,JPO&INPIT |
