| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is excellent in fluidity of a composition, and achieves reliability in moisture resistance suitable to electronic component-related material of recent years and high flame retardancy without using halogen for environmental harmony; and to provide a cured product thereof, a semiconductor sealing material using the compound, and a phenol resin and an epoxy resin giving these performances. <P>SOLUTION: The phenol resin has a naphthylmethyl group or anthranylmethyl group at an aromatic nucleus of a resin structure (α) in which two or more phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded through a divalent aralkyl group shown by general formula 1 (in the formula, Ar denotes a phenylene group or a biphenylene group; and R independently denotes a hydrogen atom or a methyl group), and has a resin structure in which 5-50 mole% of a phenolic hydroxyl group of the resin structure (α) is subjected to naphthylmethyl etherification or anthranylmethyl etherification. The phenol resin is used as an epoxy resin raw material or a curing agent for an epoxy resin. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
