发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM
摘要 A method of manufacturing a semiconductor device is provided, which enables the film quality to be improved when the film is formed on a substrate at a low temperature, thus forming fine patterns. The method of manufacturing a semiconductor device includes: forming the film on a substrate by alternately supplying at least a source gas and a reactive gas to the substrate while maintaining the substrate at a first temperature by heating; and modifying the film by supplying a modification gas excited by plasma to the substrate with the film formed thereon while naturally cooling the substrate with the film formed thereon to a second temperature without heating the substrate, the second temperature being lower than the first temperature.
申请公布号 US2015044880(A1) 申请公布日期 2015.02.12
申请号 US201314388160 申请日期 2013.03.25
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 Noda Takaaki;Hanashima Takeo
分类号 H01L21/02;C23C16/46;C23C16/52;C23C16/50 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device comprising: forming a film on a substrate by alternately supplying at least a source gas and a reactive gas to the substrate while maintaining the substrate at a first temperature by heating; and modifying the film by supplying a modification gas excited by plasma to the substrate with the film formed thereon while naturally cooling the substrate with the film formed thereon to a second temperature without heating the substrate, the second temperature being lower than the first temperature.
地址 Tokyo JP