THIN PACKAGE STRUCTURE WITH ENHANCED STRENGTH

摘要

A thin package structure with enhanced strength includes a support carrier plate and a thin circuit board. The thin circuit board is formed on the support carrier plate and includes a first circuit layer, a dielectric layer and a second circuit layer. The first circuit layer includes the first circuit patterns and the first connection pads. The dielectric layer covers the first circuit layer. The second circuit layer is formed on or embedded in an upper surface of the dielectric layer and includes the second circuit patterns and the second connection pads. Connection plugs are formed in the dielectric layer to connect the first and second connection pads. The support carrier plate provides mechanical strength to avoid warping or deforming. It is feasible to direct test the package structure without disassembling so as to improve the convenience in testing.

主权项

1. A thin package structure with enhanced strength, comprising:
a support carrier plate; and a thin circuit board formed on the support carrier plate, and including at least a first circuit layer formed on an upper surface of the support carrier plate, a dielectric layer and a second circuit layer, wherein the first circuit layer includes a plurality of first circuit patterns and a plurality of first connection pads, the first circuit patterns and the first connection pads are connected to each other, the dielectric layer is formed on the upper surface of the support carrier plate to cover the first circuit layer and has a plurality of holes, the second circuit layer is formed on or embedded in an upper surface of the dielectric layer and includes a plurality of second circuit patterns and a plurality of second connection pads, the second circuit patterns and the second connection pads are connected to each other, a plurality of connection plugs are formed in the holes of the dielectric layer, each connection plug is connected to the corresponding first and second connection pads, and a plurality of openings are formed on the support carrier plate, each opening corresponding to the first connection pad.