PHOTOSENSITIVE RESIN COMPOSITION, RELIEF PATTERN FILM THEREOF, METHOD FOR PRODUCING RELIEF PATTERN FILM, ELECTRONIC COMPONENT OR OPTICAL PRODUCT INCLUDING RELIEF PATTERN FILM, AND ADHESIVE INCLUDING PHOTOSENSITIVE RESIN COMPOSITION

摘要

The objective of the present invention is to obtain a photosensitive resin composition which does not have the defects of conventional technology and which is capable of forming an accurate polyimide pattern easily by a low-temperature process. A photosensitive resin composition is obtained which is characterized by comprising (A) a polymeric precursor having repeating units of a polyamic acid or a polyamic acid ester in at least a portion thereof, and (B) a nonionic photoreactive latent basic substance which generates strongly basic tertiary amine upon irradiation of active light.