SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: The semiconductor device comprises: a wiring board 3 having a plurality of bonding fingers (terminals) BF formed on a chip mounting surface; a semiconductor chip mounted on the wiring board 3; and a plurality of wires BW which each have a ball portion Bnd1 and a stitch portion Bnd2. The plural bonding fingers BF comprises: a bonding finger BF1 to which each stitch portion Bnd2 of a wire BWa is connected; and a bonding finger BF2 to which the ball portion Bnd1 of a wire BWb is connected. In a planar view, the bonding finger BF2 is located at a position different from a placement row Bd1 of the plural bonding fingers BF1, and a width W2 of the bonding finger BF2 is larger than a width W1 of the bonding finger BF1.