| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, which has excellent low thermal expansivity, a high glass transition temperature, and low dielectricity and which excels also in copper foil adhesion, solder heat resistance, heat resistance with copper, flame retardancy, and drillability, and which is low in toxicity and is excellent in safety and work environment, and which is suitable for an electronic component or the like, and to provide a prepreg, and a laminated board. <P>SOLUTION: The thermosetting resin composition, a prepreg, and a laminated board are provided, wherein the thermosetting resin composition contains maleic anhydride (A), a compound (B) having at least two primary amino groups in a molecule, a compound (C) having at least two aldehyde groups in a molecule, and a metal hydrate (D) with a thermal decomposition temperature of 300°C or more. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
