| 发明名称 |
Multilayer Electronic Structures with Embedded Filters |
| 摘要 |
A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter;;the at least one capacitor being sandwiched between the at least one feature layer and at least one via in said at least adjacent via layer, such that the at least one via stands on the at least one capacitor, and the at least one of the first feature layer and the adjacent via layer includes at least one inductor extending in the XY plane. |
| 申请公布号 |
US2015042415(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201313962316 |
申请日期 |
2013.08.08 |
| 申请人 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
发明人 |
Hurwitz Dror;Huang Alex |
| 分类号 |
H03H7/01;H03H3/00 |
主分类号 |
H03H7/01 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z,
wherein the composite electronic structure comprises at least one capacitor coupled with at least one inductor, the at least one capacitor comprising a lower electrode and a dielectric layer and being incorporated at a base of a via layer sandwiched between the at least one feature layer and a via post, such that the at least one via stands on the at least one capacitor, and optionally forms an upper electrode, wherein the via layer is embedded in a polymer matrix, and wherein the at least one inductor is formed in at least one of the first feature layer and the adjacent via layer |
| 地址 |
Zhuhai CN |
