| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermoelectric thin film device in which peeling of a thermoelectric thin film can be prevented effectively by enhancing adhesion of a substrate and the thermoelectric thin film, and an electromotive force can be obtained efficiently while thinning and down-sizing the device. <P>SOLUTION: The thermoelectric thin film device 1 comprises a thermoelectric thin film element 3 in which a plurality of p-type thin film patterns 4 and n-type thin film patterns 5 are arranged alternately on an insulating substrate 2, adjoining thin film patterns of different types are bonded, and power is generated by forming a temperature difference on a two-dimensional plane. A buffer layer 10 is arranged on the boundary surface of the insulating substrate 2 and the thermoelectric thin film element 3, so that the ratio of electrical resistance of the thermoelectric thin film element 3 and the buffer layer 10 will be 10<SP POS="POST">-5</SP>-0.4. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
